Name: W66BL6NBUAGI by Winbond Electronics Corporation
Brand: Winbond Electronics Corporation
SKU: W66BL6NBUAGI-7318626081

I/O Type
COMMON
Technology
CMOS
Width (mm)
10
Access Mode
MULTI BANK PAGE BURST
Length (mm)
14.5
JESD-30 Code
R-PBGA-B200
Memory Width
16
Package Code
VFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
LPDDR4 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY VOLTAGE
Memory Organization
128MX16
Number of Functions
1
Number of Terminals
200
Terminal Pitch (mm)
0.8
Number of Words Code
128M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
0.8
Supply Voltage-Max (V)
1.17
Supply Voltage-Min (V)
1.06
Supply Voltage-Nom (V)
1.1
Number of Words (words)
134217728
Sequential Burst Length
16,32
Interleaved Burst Length
16,32
Package Equivalence Code
BGA200,12X20,32/25
Clock Frequency-Max (MHz)
1869.1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
95
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

W66BL6NBUAGI

Winbond Electronics Corporation