Winbond Electronics Corporation W631GG6MB12I | 搜芯易Sourcengine

Winbond Electronics Corporation W631GG6MB12I

生命周期状态
NRFND
RoHS
符合RoHS标准
REACH
REACH compliant
说明
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin VFBGA
类别
Semiconductors Memory ICs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.32
SB Code
8542.32.00.15

Technology
CMOS
Width (mm)
7.5000
Access Mode
MULTI BANK PAGE BURST
Length (mm)
13.0000
JESD-30 Code
R-PBGA-B96
Memory Width
16
Package Code
VFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
64MX16
Number of Functions
1
Number of Terminals
96
Terminal Pitch (mm)
0.800
Number of Words Code
64M
Memory Density (bits)
1073741824.0000000000000000
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.0000
Supply Voltage-Max (V)
1.57500
Supply Voltage-Min (V)
1.42500
Supply Voltage-Nom (V)
1.5
Number of Words (words)
67108864.0000000000000000
Operating Temperature-Max (Cel)
95.0
Operating Temperature-Min (Cel)
-40.0