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W55F10B

Winbond Electronics Corporation

Winbond Electronics Corporation W55F10B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Endurance
    100000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    1
  • Organization
    1MX1
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    1048576 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Number of Words
    1048576 words
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    10 mA
  • Number of Functions
    1
  • Number of Terminals
    8
  • Programming Voltage
    5 V
  • Standby Current-Max
    4.0E-6 Amp
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    10
  • Package Equivalence Code
    DIP8(UNSPEC)
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    2.4 V
  • Supply Voltage-Nom (Vsup)
    4.5 V
  • Clock Frequency-Max (fCLK)
    1 MHz

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