Microsemi Corporation W3J512M32K-XHDX | 搜芯易Sourcengine

Microsemi Corporation W3J512M32K-XHDX

生命周期状态
Transferred
REACH
REACH compliant
说明
DDR3L DRAM, 512MX32, CMOS, PBGA168
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
10
Access Mode
SINGLE BANK PAGE BURST
Length (mm)
14
JESD-30 Code
R-PBGA-B168
Memory Width
32
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY
Memory Organization
512MX32
Number of Functions
1
Number of Terminals
168
Number of Words Code
512M
Memory Density (bits)
17179869184
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
1.35
Number of Words (words)
536870912