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W3J512M32K-1333BC

Microsemi Corporation

Microsemi Corporation W3J512M32K-1333BC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    10.1 mm
  • Length
    14.6 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    SINGLE BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B136
  • Memory Width
    32
  • Organization
    512MX32
  • Package Code
    FBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    17179869184 bit
  • Memory IC Type
    DDR3L DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    0.255 ns
  • Number of Ports
    1
  • Number of Words
    536870912 words
  • Seated Height-Max
    3.84 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
  • Supply Current-Max
    880 mA
  • Number of Functions
    1
  • Number of Terminals
    136
  • Standby Current-Max
    0.072 Amp
  • Number of Words Code
    512M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    8
  • Interleaved Burst Length
    8
  • Package Equivalence Code
    BGA136,12X17,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Supply Voltage-Min (Vsup)
    1.283 V
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Clock Frequency-Max (fCLK)
    667 MHz

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