Microsemi Corporation W3J128M72K-1066PBM | 搜芯易Sourcengine

Microsemi Corporation W3J128M72K-1066PBM

生命周期状态
Transferred
说明
DDR3L DRAM, 128MX72, 0.3ns, CMOS, PBGA375
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
20.75
Access Mode
SINGLE BANK PAGE BURST
Length (mm)
21.75
JESD-30 Code
R-PBGA-B375
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
128MX72
Number of Functions
1
Number of Terminals
375
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.3
Number of Words Code
128M
Memory Density (bits)
9663676416
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
6
Supply Voltage-Max (V)
1.45
Supply Voltage-Min (V)
1.283
Supply Voltage-Nom (V)
1.35
Number of Words (words)
134217728
Standby Current-Max (A)
0.06
Supply Current-Max (mA)
860
Package Equivalence Code
BGA375,18X21,40
Clock Frequency-Max (MHz)
533
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55