Microsemi Corporation W3J128M64K-1333LBI | 搜芯易Sourcengine

Microsemi Corporation W3J128M64K-1333LBI

生命周期状态
Transferred
REACH
REACH compliant
说明
DDR3L DRAM, 128MX64, CMOS, PBGA375
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
19.25
Access Mode
SINGLE BANK PAGE BURST
Length (mm)
21.75
JESD-30 Code
R-PBGA-B375
Memory Width
64
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Memory Organization
128MX64
Number of Functions
1
Number of Terminals
375
Terminal Pitch (mm)
1
Number of Words Code
128M
Memory Density (bits)
8589934592
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.96
Supply Voltage-Max (V)
1.45
Supply Voltage-Min (V)
1.283
Supply Voltage-Nom (V)
1.35
Number of Words (words)
134217728
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40