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W3HG264M64EEU665D4IG

Microsemi Corporation

Microsemi Corporation W3HG264M64EEU665D4IG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDMA-N200
  • Memory Width
    64
  • Organization
    128MX64
  • Package Code
    DIMM
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    8589934592 bit
  • Memory IC Type
    DDR DRAM MODULE
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.6 mm
  • Access Time-Max
    0.45 ns
  • Number of Words
    134217728 words
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    1272 mA
  • Number of Terminals
    200
  • Standby Current-Max
    0.112 Amp
  • Number of Words Code
    128M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM200,24
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    333 MHz

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