MERCURY SYSTEMS INC W3H64M64E-667SBM | 搜芯易Sourcengine

MERCURY SYSTEMS INC W3H64M64E-667SBM

生命周期状态
Contact Mfr
说明
DDR2 DRAM, 64MX64, 0.45ns, CMOS, PBGA208
类别
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
16.1
Access Mode
MULTI BANK PAGE BURST
Length (mm)
22.1
JESD-30 Code
R-PBGA-B208
Memory Width
64
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
64MX64
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.45
Number of Words Code
64M
Memory Density (bits)
4294967296
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
5.07
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
67108864
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Time@Peak Reflow Temperature-Max (s)
30