MERCURY SYSTEMS INC W3H32M72E-667BM | 搜芯易Sourcengine

MERCURY SYSTEMS INC W3H32M72E-667BM

生命周期状态
Active
REACH
REACH compliant
说明
DDR2 DRAM, 32MX72, 0.65ns, CMOS, PBGA208
类别
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
16.1
Access Mode
FOUR BANK PAGE BURST
Length (mm)
20.1
JESD-30 Code
R-PBGA-B208
Memory Width
72
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Finish
Tin/Lead (Sn63Pb37)
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATE
Memory Organization
32MX72
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.65
Number of Words Code
32M
Memory Density (bits)
2415919104
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.83
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
33554432
Moisture Sensitivity Level
3
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55