Microsemi Corporation W3H128M72E0533SBC | 搜芯易Sourcengine

Microsemi Corporation W3H128M72E0533SBC

生命周期状态
Transferred
REACH
REACH compliant
说明
DDR2 DRAM, 128MX16, 0.5ns, CMOS, PDSO208
类别
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
16.15
Access Mode
MULTI BANK PAGE BURST
Length (mm)
22.15
JESD-30 Code
R-PDSO-G66
Memory Width
16
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX
Memory Organization
128MX16
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
1
Access Time-Max (ns)
0.5
Number of Words Code
128M
Memory Density (bits)
2147483648
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
5.15
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
134217728
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0