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W3E16M64S-266BM

MERCURY SYSTEMS INC

MERCURY SYSTEMS INC W3E16M64S-266BM
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B219
  • Memory Width
    64
  • Organization
    16MX64
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    DDR1 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Access Time-Max
    0.75 ns
  • Number of Ports
    1
  • Number of Words
    16777216 words
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO REFRESH
  • Number of Functions
    1
  • Number of Terminals
    219
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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W3E16M64S-266BM