Winbond Electronics Corporation W25Q20BWSNIP | 搜芯易Sourcengine

Winbond Electronics Corporation W25Q20BWSNIP

生命周期状态
Active-Unconfirmed
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Flash, 256KX8, PDSO8
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
CMOS
Width (mm)
3.9
Length (mm)
4.9
JESD-30 Code
R-PDSO-G8
Memory Width
8
Package Code
SOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
FLASH
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Serial Bus Type
SPI
Write Protection
HARDWARE/SOFTWARE
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Memory Organization
256KX8
Number of Functions
1
Number of Terminals
8
Terminal Pitch (mm)
1.27
Number of Words Code
256K
Memory Density (bits)
2097152
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.75
Supply Voltage-Max (V)
1.95
Supply Voltage-Min (V)
1.65
Supply Voltage-Nom (V)
1.8
Data Retention Time-Min
20
Number of Words (words)
262144
Programming Voltage (V)
1.8
Standby Current-Max (A)
5.0E-6
Supply Current-Max (mA)
25
Package Equivalence Code
SOP8,.25
Clock Frequency-Max (MHz)
80
Endurance (Write/Erase Cycles)
100000
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40