Winbond Electronics Corporation W231024H-30 | 搜芯易Sourcengine

Winbond Electronics Corporation W231024H-30

生命周期状态
Discontinued
说明
MASK ROM, 128KX8, 300ns, MOS
类别
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
MOS
Memory Width
8
Memory IC Type
MASK ROM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Memory Organization
128KX8
Number of Functions
1
Access Time-Max (ns)
300
Number of Words Code
128K
Memory Density (bits)
1048576
Supply Voltage-Nom (V)
5
Number of Words (words)
131072
Supply Current-Max (mA)
80
Package Equivalence Code
DIE OR CHIP
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0