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UPD23C32300F9-XXX-BC3

NEC Corporation

NEC Corporation UPD23C32300F9-XXX-BC3
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    MOS
  • Width (mm)
    6
  • Length (mm)
    8
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    4MX16
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    120
  • Number of Words Code
    2M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Seated Height-Max (mm)
    1.07
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Supply Current-Max (mA)
    50
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -10

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