Integrated Device Technology, Inc. TSI381-66IL | 搜芯易Sourcengine

Integrated Device Technology, Inc. TSI381-66IL

生命周期状态
Transferred
说明
CABGA 13.00x13.00x1.40 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
13
Length (mm)
13
JESD-30 Code
S-PBGA-B144
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
TIN LEAD
Address Bus Width
32
Bus Compatibility
PCI
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
144
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.8
Supply Voltage-Max (V)
1.26
Supply Voltage-Min (V)
1.14
Supply Voltage-Nom (V)
1.2
External Data Bus Width
32
Drive Interface Standard
IEEE 1149.6; IEEE 1149.1
Clock Frequency-Max (MHz)
66
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
20