TENX TECHNOLOGY INC TP66P08DC24
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • JESD-30 Code
    R-PDIP-T24
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    DIP24,.3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -5

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TP66P08DC24
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TP66P08DC24