RAYTHEON SEMICONDUCTOR TMC2310L4V
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • JESD-30 Code
    S-CQFP-F100
  • Package Code
    QFF
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Additional Feature
    INTERNAL COEFFICIENT LOOK-UP TABLE ROM; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 20MHZ
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.635
  • Output Data Bus Width
    10
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    19
  • Supply Current-Max (mA)
    160
  • Package Equivalence Code
    QFL100,.7SQ,25
  • Clock Frequency-Max (MHz)
    15
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, FFT PROCESSOR
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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