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THGBM1G6D4EBAI4

Toshiba Corporation

Toshiba Corporation THGBM1G6D4EBAI4
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    MLC NAND TYPE
  • Width
    12 mm
  • Length
    18 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B169
  • Memory Width
    16
  • Organization
    4GX16
  • Package Code
    LFBGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    68719476736 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Words
    4294967296 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Seated Height-Max
    1.3 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    169
  • Programming Voltage
    3.3 V
  • Number of Words Code
    4G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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