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TE28F128J3D75B

Micron Technology

Micron Technology TE28F128J3D75B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-PDSO-G56
  • Memory Width
    16
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    4/8
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    8MX16
  • Number of Terminals
    56
  • Sector Size (words)
    128K
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    75
  • Number of Words Code
    8M
  • Memory Density (bits)
    134217728
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    128
  • Number of Words (words)
    8388608
  • Standby Current-Max (A)
    0.00012
  • Supply Current-Max (mA)
    80
  • Package Equivalence Code
    TSSOP56,.8,20
  • Peak Reflow Temperature (Cel)
    235
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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TE28F128J3D75B
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TE28F128J3D75B