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TC74VHCV17FK

Toshiba Corporation

Toshiba Corporation TC74VHCV17FK
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    AHC/VHC/H/U/V
  • Technology
    CMOS
  • Width (mm)
    3
  • Length (mm)
    4
  • JESD-30 Code
    R-PDSO-G14
  • Package Code
    VSSOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Number of Inputs
    1
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    6
  • Number of Terminals
    14
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    27
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.8
  • Supply Voltage-Nom (V)
    2.5
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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TC74VHCV17FK