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TC59YM916BKG32C

Toshiba Corporation

TC59YM916BKG32C 产品规格书
Toshiba Corporation TC59YM916BKG32C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    14.56
  • Access Mode
    BLOCK ORIENTED PROTOCOL
  • Length (mm)
    15.18
  • JESD-30 Code
    R-PBGA-B100
  • Memory Width
    16
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    RAMBUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    4096
  • Number of Ports
    1
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Additional Feature
    SELF CONTAINED REFRESH
  • Memory Organization
    32MX16
  • Number of Functions
    1
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    32M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.86
  • Supply Voltage-Min (V)
    1.74
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    33554432
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    1450
  • Package Equivalence Code
    BGA100,11X16,50/32

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