产品制造商
提交询价BOM 工具

TC58FVM5T2AXG65

Toshiba Corporation

Toshiba Corporation TC58FVM5T2AXG65
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    TOP
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Width (mm)
    7
  • Length (mm)
    10
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B56
  • Memory Width
    16
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    2MX16
  • Number of Functions
    1
  • Number of Terminals
    56
  • Sector Size (words)
    8K,64K
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    65
  • Number of Words Code
    2M
  • Memory Density (bits)
    33554432
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    8,63
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    2097152
  • Programming Voltage (V)
    3
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    70
  • Package Equivalence Code
    BGA60,8X12,32
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

TC58FVM5T2AXG65有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
TC58FVM5T2AXG65
提交询价
TC58FVM5T2AXG65