Toshiba Corporation TC358867XBG | 搜芯易Sourcengine

Toshiba Corporation TC358867XBG

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Interface - Specialized Embedded DP to Dual DSI Bridge
类别
Semiconductors Consumer ICs Other Consumer ICs CONSUMER CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
7
Length (mm)
7
JESD-30 Code
S-PBGA-B80
Package Code
VFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Consumer IC Type
CONSUMER CIRCUIT
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
ALSO OPERATES AT 1.71V TO 1.89V
Number of Functions
1
Number of Terminals
80
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1
Supply Voltage-Max (V)
1.26
Supply Voltage-Min (V)
1.14
Package Equivalence Code
BGA80,10X10,25
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-20
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED