SYM53C895P9

Broadcom Inc.

Broadcom Inc. SYM53C895P9
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    28
  • Length (mm)
    28
  • JESD-30 Code
    S-PQFP-G208
  • Package Code
    FQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    32
  • Bus Compatibility
    PCI
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    208
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.1
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    33.33
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, SCSI
  • Data Transfer Rate-Max (MBps)
    80
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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