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STP1030BGA-166

SUN MICROSYSTEMS INC

SUN MICROSYSTEMS INC STP1030BGA-166
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • Width (mm)
    43
  • Length (mm)
    43
  • RAM (words)
    0
  • Speed (MHz)
    166
  • JESD-30 Code
    S-PBGA-B521
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    NO
  • Integrated Cache
    NO
  • Address Bus Width
    41
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    521
  • Terminal Pitch (mm)
    1.27
  • Number of Serial I/Os
    0
  • Package Body Material
    PLASTIC/EPOXY
  • Number of DMA Channels
    0
  • On Chip Data RAM Width
    0
  • Seated Height-Max (mm)
    2.82
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.2
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    128
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Number of External Interrupts
    0
  • Operating Temperature-Min (Cel)
    0

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STP1030BGA-166
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STP1030BGA-166