STACKED TECHNOLOGIES INC ST9D364M64SBG2M187 | 搜芯易Sourcengine

STACKED TECHNOLOGIES INC ST9D364M64SBG2M187

生命周期状态
Contact Mfr
说明
DDR3 DRAM Module, 64MX64, CMOS, PBGA271
类别
Semiconductors Memory ICs DRAMs DDR3 DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
16
Access Mode
MULTI BANK PAGE BURST
Length (mm)
22
JESD-30 Code
R-PBGA-B271
Memory Width
64
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3 DRAM MODULE
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
64MX64
Number of Functions
1
Number of Terminals
271
Terminal Pitch (mm)
1
Number of Words Code
64M
Memory Density (bits)
4294967296
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.9
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.425
Supply Voltage-Nom (V)
1.5
Number of Words (words)
67108864
Sequential Burst Length
4,8
Standby Voltage-Min (V)
1.425
Supply Current-Max (mA)
520
Interleaved Burst Length
4,8
Package Equivalence Code
BGA271,13X21,40
Clock Frequency-Max (MHz)
533
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55