Integrated Device Technology, Inc. SSTUAF32869AHLF | 搜芯易Sourcengine

Integrated Device Technology, Inc. SSTUAF32869AHLF

生命周期状态
Transferred
RoHS
符合RoHS标准
说明
CABGA 13.00x8.00x1.20 mm 0.65mm Pitch
类别
Semiconductors Logic ICs FF/Latches D FLIP-FLOP

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Family
32869
Width (mm)
8
Length (mm)
13
JESD-30 Code
R-PBGA-B150
Package Code
TFBGA
Trigger Type
POSITIVE EDGE
Logic IC Type
D FLIP-FLOP
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Number of Bits
14
fmax-Min (MHz)
340
Output Polarity
TRUE
Terminal Finish
TIN SILVER COPPER
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Functions
1
Number of Terminals
150
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Output Characteristics
OPEN-DRAIN
Propagation Delay (ns)
1.9
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Package Equivalence Code
BGA150,11X19,25
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0