Smart Modular Technologies, Inc. SH8M08GAETCEBAA01 | 搜芯易Sourcengine

Smart Modular Technologies, Inc. SH8M08GAETCEBAA01

生命周期状态
Discontinued
说明
Flash, 8GX8, PBGA100
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
MLC NAND TYPE
Technology
CMOS
JESD-30 Code
R-PBGA-B100
Memory Width
8
Organization
8GX8
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
68719476736 bit
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Number of Words
8589934592 words
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
IT IS ALSO AVAILABLE WITH BGA-169 PACKAGE
Number of Functions
1
Number of Terminals
100
Programming Voltage
3.3 V
Number of Words Code
8G
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
3.3 V