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SG9CF4GSMEAIF

Smart Modular Technologies, Inc.

Smart Modular Technologies, Inc. SG9CF4GSMEAIF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Technology
    CMOS
  • Width (mm)
    36.4
  • Length (mm)
    41.66
  • JESD-30 Code
    R-XUUC-N50
  • Memory Width
    8
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    FLASH CARD
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    UPPER
  • Memory Organization
    4GX8
  • Number of Functions
    1
  • Number of Terminals
    50
  • Number of Words Code
    4G
  • Memory Density (bits)
    34359738368
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    3.3
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Data Retention Time-Min
    10
  • Number of Words (words)
    4294967296
  • Standby Current-Max (A)
    0.008
  • Supply Current-Max (mA)
    40
  • Endurance (Write/Erase Cycles)
    2000000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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