E-tec Interconnect SDC-764-S118-55 | 搜芯易Sourcengine

E-tec Interconnect SDC-764-S118-55

生命周期状态
Contact Mfr
RoHS
符合RoHS标准
说明
IC Socket, DIP64, 64 Contact(s), 1.778mm Term Pitch, 19.05mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
J-STD-609 Code
e4
Mounting Style
STRAIGHT
Contact Material
BE-CU
Housing Material
POLYBUTYLENE TEREPHTHALATE
Termination Type
SOLDER
Additional Feature
ROHS COMPLIANT
Body Length (inch)
2.27
Current Rating (A)
1
Device Socket Type
IC SOCKET
Number of Contacts
64
Device Type Used On
DIP64
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
1.778
Contact Finish - Mating
AU
Socket Body Depth (inch)
0.159
Insulation Resistance (ohm)
5000000000
Mating Contact Pitch (inch)
0.07
Contact Finish - Termination
Gold (Au)
PCB Contact Row Spacing (mm)
19.05
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Dielectric Withstanding Voltage (V)
500VAC