BECK IPC GMBH SC123-LF | 搜芯易Sourcengine

BECK IPC GMBH SC123-LF

生命周期状态
Contact Mfr
RoHS
符合RoHS标准
说明
Microprocessor Circuit, CMOS, PBGA177
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
25
Length (mm)
25
JESD-30 Code
S-PBGA-B177
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Terminals
177
Terminal Pitch (mm)
1.27
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
5
Supply Voltage-Max (V)
3.465
Supply Voltage-Min (V)
3.135
Supply Voltage-Nom (V)
3.3
Package Equivalence Code
BGA177,17X17,50
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-25