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S70FS01GSAGBHI213

SPANSION INC.

SPANSION INC. S70FS01GSAGBHI213
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    8
  • JESD-30 Code
    R-PBGA-B24
  • Memory Width
    4
  • Package Code
    TBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    IT ALSO HAVE MEMORY WIDTH X1
  • Memory Organization
    256MX4
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    256M
  • Memory Density (bits)
    1073741824
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    2
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    2
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    268435456
  • Programming Voltage (V)
    1.8
  • Clock Frequency-Max (MHz)
    133
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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S70FS01GSAGBHI213
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S70FS01GSAGBHI213