Samsung Semiconductor, Inc. S5T3170X01-D0B0 | 搜芯易Sourcengine

Samsung Semiconductor, Inc. S5T3170X01-D0B0

生命周期状态
Discontinued
REACH
REACH compliant
说明
DTMF Signaling Circuit, CMOS, PDIP18
类别
Semiconductors Telecom ICs Telecom Signaling Circuits DTMF SIGNALING CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
7.62
Length (mm)
22.95
JESD-30 Code
R-PDIP-T18
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
Telecom IC Type
DTMF SIGNALING CIRCUIT
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL EXTENDED
Terminal Position
DUAL
Number of Functions
1
Number of Terminals
18
Terminal Pitch (mm)
2.54
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
5.08
Supply Voltage-Nom (V)
5
Supply Current-Max (mA)
0.009
Package Equivalence Code
DIP18,.3
Moisture Sensitivity Level
1
Operating Temperature-Max (Cel)
75
Operating Temperature-Min (Cel)
-25