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S524C20D11-RCB0

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. S524C20D11-RCB0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Endurance
    1000000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    8
  • Organization
    128X8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    1024 bit
  • Memory IC Type
    EEPROM
  • Terminal Pitch
    0.635 mm
  • Number of Words
    128 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • I2C Control Byte
    1010DDDR
  • Write Protection
    HARDWARE
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Supply Current-Max
    3 mA
  • Number of Terminals
    8
  • Standby Current-Max
    5.0E-6 Amp
  • Number of Words Code
    128
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    100
  • Package Equivalence Code
    TSSOP8,.25
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -25 Cel

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S524C20D11-RCB0