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S524AE0XH1-DCU

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. S524AE0XH1-DCU
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Endurance
    500000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    8
  • Organization
    64KX8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    524288 bit
  • Memory IC Type
    EEPROM
  • Terminal Pitch
    2.54 mm
  • Number of Words
    65536 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • I2C Control Byte
    1010DDDR
  • Write Protection
    HARDWARE
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Supply Current-Max
    3 mA
  • Number of Terminals
    8
  • Standby Current-Max
    1.0E-6 Amp
  • Number of Words Code
    64K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    50
  • Package Equivalence Code
    DIP8,.3
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -25 Cel

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