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S34ML04G100BHI003

SPANSION INC.

SPANSION INC. S34ML04G100BHI003
  • ECCN
    3A991.B.1.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    9
  • Length (mm)
    11
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    8
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    2K
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    512MX8
  • Number of Functions
    1
  • Number of Terminals
    63
  • Sector Size (words)
    128K
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    25
  • Number of Words Code
    512M
  • Memory Density (bits)
    4294967296
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    NO
  • Number of Sectors/Size
    4K
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Data Retention Time-Min
    10
  • Number of Words (words)
    536870912
  • Programming Voltage (V)
    3.3
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    35
  • Package Equivalence Code
    BGA64,10X12,32
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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S34ML04G100BHI003
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S34ML04G100BHI003