产品制造商
提交询价BOM 工具

S30ML256P30BFI500

SPANSION INC.

SPANSION INC. S30ML256P30BFI500
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NAND TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    8
  • Length (mm)
    10
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B55
  • Memory Width
    8
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    512
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    32MX8
  • Number of Functions
    1
  • Number of Terminals
    55
  • Sector Size (words)
    512K
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    30
  • Number of Words Code
    32M
  • Memory Density (bits)
    268435456
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    64
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    33554432
  • Programming Voltage (V)
    2.7
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    73
  • Package Equivalence Code
    BGA55,8X12,32
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

S30ML256P30BFI500有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
S30ML256P30BFI500
提交询价
S30ML256P30BFI500