产品制造商
提交询价BOM 工具

S29JL064H70BFI002

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) S29JL064H70BFI002
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM/TOP
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    4MX16
  • Number of Terminals
    63
  • Sector Size (words)
    8K,64K
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    70
  • Number of Words Code
    4M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    16,126
  • Number of Words (words)
    4194304
  • Standby Current-Max (A)
    5.0E-6
  • Supply Current-Max (mA)
    45
  • Package Equivalence Code
    BGA63,8X12,32
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

S29JL064H70BFI002有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
S29JL064H70BFI002
提交询价
S29JL064H70BFI002