Advanced Micro Devices, Inc. (AMD) S29GL256N90TAI013 | 搜芯易Sourcengine

Advanced Micro Devices, Inc. (AMD) S29GL256N90TAI013

生命周期状态
Transferred
说明
Flash, 16MX16, 90ns, PDSO56
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Ready/Busy
YES
Technology
CMOS
Toggle Bit
YES
Data Polling
YES
JESD-30 Code
R-PDSO-G56
Memory Width
16
Package Code
TSSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Page Size (words)
8/16
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Memory Organization
16MX16
Number of Functions
1
Number of Terminals
56
Sector Size (words)
128K
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
90
Number of Words Code
16M
Memory Density (bits)
268435456
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
8
Command User Interface
YES
Common Flash Interface
YES
Number of Sectors/Size
256
Output Characteristics
3-STATE
Number of Words (words)
16777216
Standby Current-Max (A)
5.0E-6
Supply Current-Max (mA)
70
Package Equivalence Code
TSSOP56,.8,20
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40