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S29AL004D70MFN023

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) S29AL004D70MFN023
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PDSO-G44
  • Memory Width
    16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Memory Organization
    256KX16
  • Number of Terminals
    44
  • Sector Size (words)
    16K,8K,32K,64K
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    70
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Number of Sectors/Size
    1,2,1,7
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    5.0E-6
  • Supply Current-Max (mA)
    35
  • Package Equivalence Code
    SOP44,.63
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

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