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S29AL004D55BFI012

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) S29AL004D55BFI012
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    TOP
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX16
  • Number of Terminals
    48
  • Sector Size (words)
    16K,8K,32K,64K
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    55
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Number of Sectors/Size
    1,2,1,7
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    5.0E-6
  • Supply Current-Max (mA)
    35
  • Package Equivalence Code
    BGA48,6X8,32
  • Endurance (Write/Erase Cycles)
    1000000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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