Teledyne Technologies Incorporated RDS010-QP | 搜芯易Sourcengine

Teledyne Technologies Incorporated RDS010-QP

生命周期状态
Active
REACH
REACH compliant
说明
Microprocessor Circuit, CMOS, CQFP88
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
14
Length (mm)
20
JESD-30 Code
R-CQFP-G88
Package Code
HQFP
Package Shape
RECTANGULAR
Package Style
FLATPACK, HEAT SINK/SLUG Meter
Surface Mount
YES
Terminal Form
GULL WING
Temperature Grade
OTHER
Terminal Position
QUAD
Number of Terminals
88
Terminal Pitch (mm)
0.65
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Supply Voltage-Max (V)
3.5
Supply Voltage-Min (V)
3.1
Supply Voltage-Nom (V)
3.3
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-15