合规信息

  • SB Code
    8542.39.00.00
  • HTS Code
    8542.39.00.01
  • ECCN Governance
    EAR
  • ECCN
    EAR99

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包装类型
包装情况
批号
其他信息

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技术详情

  • Width
    4 mm
  • Length
    4 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-XQCC-N24
  • Package Code
    HVQCCN
  • Sub Category
    Parallel IO Ports
  • JESD-609 Code
    e4
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Number of Bits
    16
  • Power Supplies
    5 V
  • Terminal Pitch
    0.5 mm
  • Number of Ports
    2
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Address Bus Width
    8
  • Seated Height-Max
    1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    0.2 mA
  • Supply Voltage-Max
    5.5 V
  • Supply Voltage-Min
    4.5 V
  • Supply Voltage-Nom
    5 V
  • Clock Frequency-Max
    0.4 MHz
  • Number of I/O Lines
    16
  • Number of Terminals
    24
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Package Equivalence Code
    LCC24,.16SQ,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Moisture Sensitivity Level
    2
  • uPs/uCs/Peripheral ICs Type
    PARALLEL IO PORT, GENERAL PURPOSE
  • Peak Reflow Temperature (Cel)
    260
  • [email protected] Reflow Temperature-Max (s)
    NOT SPECIFIED
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