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PCA9517DP

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS PCA9517DP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    3
  • Length (mm)
    3
  • JESD-30 Code
    S-PDSO-G8
  • Package Code
    TSSOP
  • Package Shape
    SQUARE
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    BUS BUFFERS
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    I2C, OPERATES WITH 2.7 V TO 5.5 V
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    0.9
  • Supply Voltage-Nom (V)
    1.2
  • Package Equivalence Code
    TSSOP8,.19
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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PCA9517DP
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PCA9517DP