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PC28F256P30BFP

Micron Technology

Micron Technology PC28F256P30BFP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    16K,64K Words
  • Data Polling
    NO
  • JESD-30 Code
    S-PBGA-B64
  • Memory Width
    16
  • Organization
    16MX16
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    268435456 bit
  • Memory IC Type
    FLASH
  • Terminal Pitch
    1 mm
  • Access Time-Max
    100 ns
  • Number of Words
    16777216 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    31 mA
  • Number of Terminals
    64
  • Standby Current-Max
    0.00021 Amp
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    4,255
  • Package Equivalence Code
    BGA64,8X8,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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PC28F256P30BFP
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PC28F256P30BFP