产品制造商
提交询价BOM 工具

PALC22V10H-30MW883B

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) PALC22V10H-30MW883B
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • Technology
    CMOS
  • Architecture
    PAL-TYPE
  • JESD-30 Code
    R-XDFP-F28
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Output Function
    MACROCELL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Number of Inputs
    22
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    10
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    28
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Product Terms
    132
  • Programmable Logic Type
    EE PLD
  • Package Equivalence Code
    FL28(UNSPEC)
  • Clock Frequency-Max (MHz)
    25
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

PALC22V10H-30MW883B有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
PALC22V10H-30MW883B
提交询价
PALC22V10H-30MW883B