产品制造商
提交询价BOM 工具

NSC830D3M

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP NSC830D3M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T40
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    2KX8
  • Number of Functions
    1
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    400
  • Number of Words Code
    2K
  • Memory Density (bits)
    16384
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2048
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    DIP40,.6
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

NSC830D3M有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
NSC830D3M
提交询价
NSC830D3M