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N74LS375FB

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS N74LS375FB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T16
  • Package Code
    DIP
  • Logic IC Type
    D LATCH
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Number of Bits
    4
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    12
  • Package Equivalence Code
    DIP16,.3
  • Output Low Current-Max (mA)
    8
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Propagation Delay-Max@Nom-Sup (ns)
    30

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N74LS375FB
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N74LS375FB