MICROSS COMPONENTS MYX4DD3K512M72PBG2-25/ET | 搜芯易Sourcengine

MICROSS COMPONENTS MYX4DD3K512M72PBG2-25/ET

生命周期状态
Active
REACH
REACH compliant
说明
DDR3L DRAM, 512MX72, CMOS, PBGA375
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
19
Access Mode
MULTI BANK PAGE BURST
Length (mm)
21.5
JESD-30 Code
R-PBGA-B375
Memory Width
72
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH; SEATED HT-CALCULATED
Memory Organization
512MX72
Number of Functions
1
Number of Terminals
375
Terminal Pitch (mm)
1
Number of Words Code
512M
Memory Density (bits)
34359738368
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.96
Supply Voltage-Max (V)
1.45
Supply Voltage-Min (V)
1.283
Supply Voltage-Nom (V)
1.35
Number of Words (words)
536870912
Sequential Burst Length
4,8
Standby Voltage-Min (V)
1.283
Interleaved Burst Length
4,8
Package Equivalence Code
BGA375,18X21,40
Clock Frequency-Max (MHz)
400
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-40